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 STFW4N150 STP4N150, STW4N150
N-channel 1500 V, 5 , 4 A, PowerMESHTM Power MOSFET in TO-220, TO-247, TO-3PF
Features
Type STFW4N150 STP4N150 STW4N150

VDSS 1500 V 1500 V 1500 V
RDS(on) max <7 <7 <7
ID 4A 4A 4A
Pw 63 W 160 W 160 W TO-220 TO-247
3 1 2
2 1
3
100% avalanche tested Intrinsic capacitances and Qg minimized High speed switching Fully isolated TO-3PF plastic packages Creepage distance path is 5.4 mm (typ.) for TO-3PF Figure 1.
TO-3PF
3 1 2
Application
Internal schematic diagram.
Switching applications
Description
Using the well consolidated high voltage MESH OVERLAYTM process, STMicroelectronics has designed an advanced family of very high voltage Power MOSFETs with outstanding performances. The strengthened layout coupled with the company's proprietary edge termination structure, gives the lowest RDS(on) per area, unrivalled gate charge and switching characteristics.
Table 1.
Device summary
Marking 4N150 P4N150 W4N150 Package TO-3PF TO-220 TO-247 Packaging Tube Tube Tube
Order codes STFW4N150 STP4N150 STW4N150
July 2009
Doc ID 11262 Rev 9
1/15
www.st.com 15
Contents
STFW4N150, STP4N150, STW4N150
Contents
1 2 Electrical ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2.1 Electrical characteristics (curves) ............................ 6
3 4 5
Test circuits
.............................................. 9
Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
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STFW4N150, STP4N150, STW4N150
Electrical ratings
1
Electrical ratings
Table 2.
Symbol VDS VGS ID ID IDM (1) PTOT VISO Tstg Tj
Absolute maximum ratings
Value Parameter TO-220 Drain-source voltage (VGS = 0) Gate- source voltage Drain current (continuous) at TC = 25 C Drain current (continuous) at TC = 100 C Drain current (pulsed) Total dissipation at TC = 25 C Insulation withstand voltage (RMS) from all three leads to external heat sink (t=1 s;TC=25 C) Storage temperature Max. operating junction temperature -55 to 150 150 4 2.5 12 160 TO-247 1500 30 4 2.5 12 4 (1) 2.5 (1) 12 (1) 63 3500 TO-3PF V V A A A W V C C Unit
1. Pulse width limited by safe operating area
Table 3.
Symbol
Thermal data
Value Parameter TO-220 TO-247 0.78 62.5 50 TO-3PF 2 C/W C/W Thermal resistance junction-case max Thermal resistance junctionambient max Unit
Rthj-case Rthj-amb
Table 4.
Symbol IAR EAS
Avalanche characteristics
Parameter Avalanche current, repetitive or not-repetitive (pulse width limited by Tj max) Single pulse avalanche energy (starting Tj = 25 C, ID = IAR, VDD = 50 V) Value 4 350 Unit A mJ
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Electrical characteristics
STFW4N150, STP4N150, STW4N150
2
Electrical characteristics
(TCASE = 25 C unless otherwise specified) Table 5.
Symbol V(BR)DSS IDSS IGSS VGS(th) RDS(on
On/off states
Parameter Drain-source Breakdown voltage Zero gate voltage Drain current (VGS = 0) Gate-body leakage current (VDS = 0) Gate threshold voltage Static drain-source on resistance Test conditions ID = 1 mA, VGS = 0 VDS = Max rating VDS = Max rating, TC = 125 C VGS = 30 V VDS = VGS, ID = 250 A VGS = 10 V, ID = 2 A 3 4 5 Min. 1500 10 500 100 5 7 Typ. Max. Unit V A A nA V
Table 6.
Symbol gfs (1) Ciss Coss Crss td(on) Tr td(off) tf Qg Qgs Qgd
Dynamic
Parameter Forward transconductance Input capacitance Output capacitance Reverse transfer capacitance Turn-on delay time Rise time Turn-off delay time Fall time Total gate charge Gate-source charge Gate-drain charge Test conditions VDS = 30 V, ID = 2 A VDS = 25 V, f = 1 MHz, VGS = 0 Min. Typ. Max. 3.5 1300 120 12 35 30 45 45 30 10 9 50 Unit S pF pF pF ns ns ns ns nC nC nC
-
VDD = 750 V, ID = 2 A, RG = 4.7 , VGS = 10 V Figure 19 VDD = 600 V, ID = 4 A, VGS = 10 V Figure 20
-
-
1. Pulsed: pulse duration=300 s, duty cycle 1.5%
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STFW4N150, STP4N150, STW4N150
Electrical characteristics
Table 7.
Symbol ISD ISDM(1) VSD(2) trr Qrr IRRM trr Qrr IRRM
Source drain diode
Parameter Source-drain current Source-drain current (pulsed) Forward on voltage Reverse recovery time Reverse recovery charge Reverse recovery current Reverse recovery time Reverse recovery charge Reverse recovery current ISD = 4 A, VGS = 0 ISD = 4 A, di/dt = 100 A/s VDD = 45 V Figure 21 ISD = 4 A, di/dt = 100 A/s VDD = 45 V, Tj = 150C Figure 21 Test conditions Min. 510 3 12 615 4 12.6 Typ. Max. 4 12 2 Unit A A V ns C A ns C A
-
-
1. Pulse width limited by safe operating area 2. Pulsed: pulse duration=300s, duty cycle 1.5%
Doc ID 11262 Rev 9
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Electrical characteristics
STFW4N150, STP4N150, STW4N150
2.1
Figure 2.
Electrical characteristics (curves)
Safe operating area for TO-220 Figure 3. Thermal impedance for TO-220
Figure 4.
ID (A)
Safe operating area for TO-3PF
AM03935v1
Figure 5.
K
Thermal impedance for TO-3PF
TO3PF
=0.5 0.2 0.1
10s 100s 1ms Tj=150C Tc=25C Sinlge pulse 10ms
10
is Op Lim era ite tion d by in th m is ax ar R ea
n)
DS (o
1
10
-1
0.05 0.02 0.01 Single pulse
0.1
0.01 0.1
1
10
100
1000
VDS(V)
10 -5 10
-2
10
-4
10
-3
10
-2
10
-1
t (s)
Figure 6.
Safe operating area for TO-247
Figure 7.
Thermal impedance for TO-247
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STFW4N150, STP4N150, STW4N150 Figure 8. Output characteristics Figure 9.
Electrical characteristics Transfer characteristics
Figure 10. Transconductance
Figure 11. Static drain-source on resistance
Figure 12. Gate charge vs gate-source voltage Figure 13. Capacitance variations
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Electrical characteristics Figure 14. Normalized gate threshold voltage vs temperature
STFW4N150, STP4N150, STW4N150 Figure 15. Normalized on resistance vs temperature
Figure 16. Source-drain diode forward characteristics
Figure 17. Normalized BVDSS vs temperature
Figure 18. Maximum avalanche energy vs temperature
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STFW4N150, STP4N150, STW4N150
Test circuits
3
Test circuits
Figure 20. Gate charge test circuit
VDD 12V
2200
Figure 19. Switching times test circuit for resistive load
47k 100nF
1k
RL VGS VD RG PW D.U.T.
F
3.3 F
VDD Vi=20V=VGMAX
2200 F
IG=CONST 100 2.7k 47k PW 1k
AM01469v1
D.U.T. VG
AM01468v1
Figure 21. Test circuit for inductive load Figure 22. Unclamped inductive load test switching and diode recovery times circuit
A D G S B 25 D.U.T.
A FAST DIODE B
A L=100H B D G 3.3 F 1000 F
L
VD
2200 F
3.3 F
VDD
VDD
ID
RG
S
Vi
D.U.T.
Pw
AM01470v1 AM01471v1
Figure 23. Unclamped inductive waveform
V(BR)DSS VD
Figure 24. Switching time waveform
ton tdon tr toff tdoff tf
90% IDM
90% 10%
ID VDD VDD
0
10%
VDS 90%
VGS
AM01472v1
0
10%
AM01473v1
Doc ID 11262 Rev 9
9/15
Package mechanical data
STFW4N150, STP4N150, STW4N150
4
Package mechanical data
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK is an ST trademark.
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STFW4N150, STP4N150, STW4N150
Package mechanical data
TO-220 mechanical data
mm Dim Min A b b1 c D D1 E e e1 F H1 J1 L L1 L20 L30 P Q 4.40 0.61 1.14 0.48 15.25 1.27 10 2.40 4.95 1.23 6.20 2.40 13 3.50 16.40 28.90 3.75 2.65 3.85 2.95 0.147 0.104 10.40 2.70 5.15 1.32 6.60 2.72 14 3.93 0.393 0.094 0.194 0.048 0.244 0.094 0.511 0.137 Typ Max 4.60 0.88 1.70 0.70 15.75 Min 0.173 0.024 0.044 0.019 0.6
inch Typ Max 0.181 0.034 0.066 0.027 0.62 0.050 0.409 0.106 0.202 0.051 0.256 0.107 0.551 0.154 0.645 1.137 0.151 0.116
Doc ID 11262 Rev 9
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Package mechanical data
STFW4N150, STP4N150, STW4N150
TO-247 Mechanical data
mm. Min. 4.85 2.20 1.0 2.0 3.0 0.40 19.85 15.45 5.45 14.20 3.70 18.50 3.55 4.50 5.50 3.65 5.50 14.80 4.30 Typ Max. 5.15 2.60 1.40 2.40 3.40 0.80 20.15 15.75
Dim. A A1 b b1 b2 c D E e L L1 L2 oP oR S
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STFW4N150, STP4N150, STW4N150
Package mechanical data
TO-3PF mechanical data
DIM. A C D D1 E F F2 G G1 H L L2 L3 L4 L5 L6 L7 N R Dia mm. typ
min. 5.30 2.80 3.10 1.80 0.80 0.65 1.80 10.30 15.30 9.80 22.80 26.30 43.20 4.30 24.30 14.60 1.80 3.80 3.40
max. 5.70 3.20 3.50 2.20 1.10 0.95 2.20 11.50 15.70 10.20 23.20 26.70 44.40 4.70 24.70 15 2.20 4.20 3.80
5.45 10
7627132_C
Doc ID 11262 Rev 9
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Revision history
STFW4N150, STP4N150, STW4N150
5
Revision history
Table 8.
Date 29-Mar-2005 07-Jul-2005 07-Oct-2005 10-Aug-2006 06-Nov-2007 09-Apr-2008 21-Jan-2009 23-Feb-2009 23-Jul-2009
Document revision history
Revision 1 2 3 4 5 6 7 8 9 Initial release Removed TO-220FP Document status promoted from preliminary data to datasheet Document reformatted, no content change Updated unit on Table 5: On/off states Added new packages: TO-220FH, TO-3PF Remove package TO-220FH Added PTOT value for TO-3PF PTOT (Table 2: Absolute maximum ratings) Added new figures: Figure 4: Safe operating area for TO-3PF and Figure 5: Thermal impedance for TO-3PF Changes
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STFW4N150, STP4N150, STW4N150
Please Read Carefully:
Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST's terms and conditions of sale. Purchasers are solely responsible for the choice, selection and use of the ST products and services described herein, and ST assumes no liability whatsoever relating to the choice, selection or use of the ST products and services described herein. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. If any part of this document refers to any third party products or services it shall not be deemed a license grant by ST for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoever of such third party products or services or any intellectual property contained therein.
UNLESS OTHERWISE SET FORTH IN ST'S TERMS AND CONDITIONS OF SALE ST DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY WITH RESPECT TO THE USE AND/OR SALE OF ST PRODUCTS INCLUDING WITHOUT LIMITATION IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE (AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION), OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. UNLESS EXPRESSLY APPROVED IN WRITING BY AN AUTHORIZED ST REPRESENTATIVE, ST PRODUCTS ARE NOT RECOMMENDED, AUTHORIZED OR WARRANTED FOR USE IN MILITARY, AIR CRAFT, SPACE, LIFE SAVING, OR LIFE SUSTAINING APPLICATIONS, NOR IN PRODUCTS OR SYSTEMS WHERE FAILURE OR MALFUNCTION MAY RESULT IN PERSONAL INJURY, DEATH, OR SEVERE PROPERTY OR ENVIRONMENTAL DAMAGE. ST PRODUCTS WHICH ARE NOT SPECIFIED AS "AUTOMOTIVE GRADE" MAY ONLY BE USED IN AUTOMOTIVE APPLICATIONS AT USER'S OWN RISK.
Resale of ST products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by ST for the ST product or service described herein and shall not create or extend in any manner whatsoever, any liability of ST.
ST and the ST logo are trademarks or registered trademarks of ST in various countries. Information in this document supersedes and replaces all information previously supplied. The ST logo is a registered trademark of STMicroelectronics. All other names are the property of their respective owners.
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Doc ID 11262 Rev 9
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